C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/1120, 400/30
C08L 25/06 (2006.01) C08L 51/04 (2006.01) C08L 53/02 (2006.01)
Patent
CA 1088693
ABSTRACT OF THE DISCLOSURE Thermoplastic molding compositions are disclosed which comprise an intimate admixture of (i) a copolymer of a vinyl aromatic compound and an ?, .beta. - unsaturated cyclic anhydride, including rubber-modified copolymers thereof, and (ii) a radial teleblock copolymer comprising a vinyl aromatic compound, a conjugated diene and a coupling agent. Optionally, the composition can also include a polyphenylene ether resin.
280728
Haaf William R.
Lee Gim F. Jr.
Company General Electric
Eckersley Raymond A.
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