Compositions and methods for separation of moieties on chips

Details Compositions and methods for separation of moieties on chips Compositions and methods for separation of moieties on chips

B - Operations, Transporting

01

D

B01D 57/02 (2006.01) B03C 5/02 (2006.01) G01N 1/28 (2006.01) G01N 33/543 (2006.01) G01N 33/569 (2006.01)

Patent

CA 2424996

The present invention recognizes that separation of components of a sample facilitate, and are often necessary for, sample analysis. Dielectrophoretic separation provides an efficient, reliable, nondisruptive, and automatable method for the separation of moieties in a sample based on their dielectric properties. The present invention provides compositions and methods for enhancing the dielectrophoretic separation of one or more moieties in a sample.

L'invention concerne un procédé permettant de faciliter la séparation de composants d'un échantillon, souvent nécessaire notamment pour l'analyse d'échantillons. Une séparation diélectrophorétique fournit un procédé efficace, sûr, non dislocant et pouvant être automatisé, destiné à la séparation de fractions dans un échantillon en fonction de leurs propriétés diélectriques. L'invention concerne également des compositions et des procédés permettant d'améliorer la séparation diélectrophorétique d'une ou de plusieurs fractions dans un échantillon.

Affiliated with

Also associated with

Rating

Compositions and methods for separation of moieties on chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compositions and methods for separation of moieties on chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compositions and methods for separation of moieties on chips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1944019