Compositions and processes for the preparation of resinous...

C - Chemistry – Metallurgy – 23 – C

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C23C 3/00 (1980.01)

Patent

CA 1058025

Abstract of the Disclosure.- Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of manganate to permanganate being up to about 1.2 and the composition having a pH controlled in the range of 11 to 13. Resinous surfaces so treated are neutralized in a process including treatment with hydrazine in order to yield metallized resinous surfaces exhibiting superior peel strengths following electroless metal deposition.

236167

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