Compositions containing hydrogenated block copolymers and...

Details Compositions containing hydrogenated block copolymers and... Compositions containing hydrogenated block copolymers and...

C - Chemistry, Metallurgy

08

L

400/1342, 400/30

C08L 53/02 (2006.01) C08L 23/02 (2006.01) C08L 23/20 (2006.01) C08L 27/00 (2006.01) C08L 33/18 (2006.01) C08L 67/00 (2006.01) C08L 67/02 (2006.01) C08L 67/04 (2006.01) C08L 69/00 (2006.01) C08L 71/12 (2006.01) C08L 75/04 (2006.01) C08L 77/00 (2006.01) C08L 101/00 (2006.01) H01B 3/30 (2006.01) C08L 59/00 (2006.01) C08L 71/00 (2006.01) C08L 75/00 (2006.01)

Patent

CA 1111987

ABSTRACT OF THE DISCLOSURE The invention relates to compositions useful as insulat- ors for electrical conductors and soldering wire and a process for preparing the compositions. An interpenetrating network is obtained by blending a partially hydrogenated block copolymer with an engineering thermoplastic resin having an apparent crystalline melting point of between 120°C and 300°C and a vis- cosity at a temperature Tp of between 150°C and 400°C and a shear rate of 100 sec.-1 of between ? minus 2,000 poise and ? plus 3,000 poise, the viscosity ? being the viscosity of the partially hydrogenated block copolymer at a temperature Tp and a shear rate of 100 sec.-1.

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