Compositions for forming epoxy adhesive containing acrylate...

C - Chemistry – Metallurgy – 08 – L

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400/2004, 402/26

C08L 63/00 (2006.01) C08F 283/10 (2006.01) C08L 33/06 (2006.01) C08L 51/08 (2006.01) C09J 4/06 (2006.01)

Patent

CA 1216385

COMPOSITIONS FOR FORMING EPOXY ADHESIVE CONTAINING ACRYLATE RUBBER Abstract of the Disclosure Reaction mixtures for forming curable epoxy resin compositions comprise a major amount of epoxy resin, a minor amount of monoethylenically unsaturated mono- mer capable of forming polyacrylate rubber, and a monomer soluble initiator. Optional ingredients in- clude a crosslinking agent for the rubber-forming mon- omer, a grafting agent for rubber and epoxy resin, and an epoxy curing agent, preferably having activation conditions which are not satisfied when the initiator is activated. Heating the reaction mixture gives epoxy resin compositions containing polyacrylate rub- ber, the latter being optionally crosslinked and/or grafted to the epoxy resin. Activation of the curing agent, e.g., by heating, yields cured adhesive compo- sitions.

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