Compositions for forming epoxy adhesive containing acrylate...

C - Chemistry – Metallurgy – 08 – F

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400/2018, 402/27

C08F 283/10 (2006.01) C08G 59/16 (2006.01) C08L 63/00 (2006.01)

Patent

CA 1219991

COMPOSITIONS FOR FORMING EPOXY ADHESIVE CONTAINING ACRYLATE RUBBER Abstract of the Disclosure Reaction mixtures for forming curable epoxy resin compositions comprise an epoxy resin, a monoethylen- ically unsaturated monomer capable of forming polyacryl- ate rubber, a chain transfer agent to allow for higher levels of rubber in the curable epoxy resin without un- desired viscosity increase and/or gellation, and a monomer soluble initiator. Optional ingredients include a crosslinking agent for the rubber-forming monomer, a grafting agent for rubber and epoxy resin, and an epoxy curing agent, preferably having activation conditions which are not satisfied when the initiator is activated. Heating the reaction mixture gives epoxy resin composi- tions containing polyacrylate rubber, the latter being optionally crosslinked and/or grafted to the epoxy resin. Activation of the curing agent, e.g., by heat- ing, when such curing agent is present, yields cured adhesive compositions.

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