C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
400/2018, 402/27
C08F 283/10 (2006.01) C08G 59/16 (2006.01) C08L 63/00 (2006.01)
Patent
CA 1219991
COMPOSITIONS FOR FORMING EPOXY ADHESIVE CONTAINING ACRYLATE RUBBER Abstract of the Disclosure Reaction mixtures for forming curable epoxy resin compositions comprise an epoxy resin, a monoethylen- ically unsaturated monomer capable of forming polyacryl- ate rubber, a chain transfer agent to allow for higher levels of rubber in the curable epoxy resin without un- desired viscosity increase and/or gellation, and a monomer soluble initiator. Optional ingredients include a crosslinking agent for the rubber-forming monomer, a grafting agent for rubber and epoxy resin, and an epoxy curing agent, preferably having activation conditions which are not satisfied when the initiator is activated. Heating the reaction mixture gives epoxy resin composi- tions containing polyacrylate rubber, the latter being optionally crosslinked and/or grafted to the epoxy resin. Activation of the curing agent, e.g., by heat- ing, when such curing agent is present, yields cured adhesive compositions.
445518
Herscovici Eva J.
Kim Ki-Soo
Gowling Lafleur Henderson Llp
Stauffer Chemical Company
LandOfFree
Compositions for forming epoxy adhesive containing acrylate... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Compositions for forming epoxy adhesive containing acrylate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compositions for forming epoxy adhesive containing acrylate... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1304525