C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 18/18 (2006.01) C08G 18/10 (2006.01) C08G 18/20 (2006.01) C09J 175/04 (2006.01) C09J 199/00 (2006.01)
Patent
CA 2080459
The present invention provides a composition for moisture curing hot melt adhesives which is superior in both moisture curing reactivity after adhesion and thermal stability during use. The composition of said moisture curing hot melt adhesives is characterized by containing a urethane prepolymer having one or more terminal isocyanate groups and a compound having the structure represented by the following formula (I): (see formula I) (where X, Y and Z in the formula (I) are alkyl groups or groups represented by the following formula (II), and at least one of X, Y and Z is a group represented by the formula (II): (see formula II) n in the formula (II) is an integer from 1 through 10, and R1 and R2 are hydrogen or alkyl groups.)
G. Ronald Bell & Associates
Sekisui Kagaku Kogyo Kabushiki Kaisha
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