Compound material for prosthetic devices

Details Compound material for prosthetic devices Compound material for prosthetic devices

B - Operations, Transporting

21

D

13/14, 167/326

B21D 53/00 (2006.01)

Patent

CA 1186107

A B S T R A C T A compound material, suitable for making prosthe- tic devices, comprises at least one layer of metal wire mesh on a metal substrate. The wires are joined to each other and to the substrate by means of metallurgic bonds at their point of contact. These metallurgic bonds may be formed by any metal but preferably by pressure-sintering, sometimes preceded by a pre-compacting step. Sintering temperatures between 600°C and 1000°C, at pressures between 1 and 150 MPa and durations between 5 minutes and 8 hours have given good results. The pre-compacting step may be effected at pressures of 10-600 MPa.

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