Compounding mica and resin with heat sensitive additives

Details Compounding mica and resin with heat sensitive additives Compounding mica and resin with heat sensitive additives

C - Chemistry, Metallurgy

08

J

18/1211

C08J 3/20 (2006.01) C08K 3/34 (2006.01) C08K 5/02 (2006.01) C08K 9/04 (2006.01) C08L 23/02 (2006.01)

Patent

CA 1145914

12 ABSTRACT OF THE DISCLOSURE Mica and melt-forming resins, such as polypropylene, are compounded with heat-sensitive additives, such as chlorinated waxes, by making the resin molten, introducing the mica particles, after first coating with heat sensitive material into the molten resin and kneading with reduced shear the mica particles and resin into a homogeneous melt. The compounding procedure permits temperature control to be exercised, with consequent avoidance of thermal degradation of the heat-sensitive additives.

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