Compounding mica and resin with heat sensitive additives

Details Compounding mica and resin with heat sensitive additives Compounding mica and resin with heat sensitive additives

B - Operations, Transporting

29

B

18/1211

B29B 1/04 (1980.01)

Patent

CA 1145915

ABSTRACT OF THE DISCLOSURE Mica and melt forming resins are rapidly compounded in a continuous process. The mica has a coating which is pro- vided by contacting the mica particles with a heat sensitive additive comprising chlorinated hydrocarbon. The melt forming resin is one formed from monomers comprising olefinic hydro- carbon monomers. The continuous method involves contacting molten resin with the coated mica and kneading the molten resin and coated mica to mix the same.

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