Compressed gaseous materials in a contained volume

F - Mech Eng,Light,Heat,Weapons – 17 – C

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Details

252/19, 49/92, 1

F17C 1/00 (2006.01) C03B 19/10 (2006.01) F17C 5/06 (2006.01)

Patent

CA 1150055

ABSTRACT The invention relates to hollow inorganic film forming material (preferably glass) microspheres of substantially uniform diameter of 200 to 10,000 microns and of substantially uniform wall thickness of 0.1 to 1,000 microns and having a contained gas pressure above 15 p.s.i.g. at ambient temperature. The micro- spheres are free of latent solid or liquid blowing gas materials or gases and the walls of the microspheres are substantially free of holes, relatively thinned wall portions or sections, sealing tips and bubbles. The microspheres may be filamented and connected to each other by filament portions which are continuous with the microspheres and are of the same inorganic film forming material.

405002

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