C - Chemistry – Metallurgy – 23 – F
Patent
C - Chemistry, Metallurgy
23
F
149/1, 356/22, 1
C23F 1/02 (2006.01) B44C 1/22 (2006.01) C03C 15/00 (2006.01) C23F 1/00 (2006.01) C23F 1/08 (2006.01) H05K 3/06 (2006.01)
Patent
CA 1289006
ABSTRACT OF THE DISCLOSURE A computer aided printer-etcher has a computer connected electrically to a printer etcher unit, such that the printer etcher unit is controlled by the computer through the keyboard and computer memory. The printer etcher unit mounts an etching chamber within a cabinet. A conveyor within the cabinet defining a conveyor film path for a metalized film which path includes a vertically oblique portion within the etching chamber. A high speed printer upstream of the etching chamber and on the conveyor film path applies a resist ink pattern onto the metal surface of the metalized film. A liquid applicator mounted downstream of the printer applied in sequence a etching liquid and a rinse liquid onto the metalized film to etch the exposed metal but not the metal covered by the resist ink pattern. The printer may be an ink jet printer. The resist may be a meltable or thermoplastic material applied as molten drops which solidify to lock out the etching liquid. A viewing window is provided within the cabinet for viewing the metalized film during droplet application of the etchant liquid and the rinse liquid. The applied liquids drain to the bottom of the etching chamber by gravity and flow to a respective etching liquid holding tank or rinse liquid holding tank through drain holes within the bottom wall of the etching chamber which are selectively closed by stopper solenoids.
562320
Gowling Lafleur Henderson Llp
Lindner Frederick H.
P.c. Proto Inc.
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