Conditioning of a substrate for electroless direct bond...

Details Conditioning of a substrate for electroless direct bond... Conditioning of a substrate for electroless direct bond...

C - Chemistry, Metallurgy

23

C

117/75

C23C 18/18 (2006.01) C23C 18/20 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1191745

CONDITIONING OF A SUBSTRATE FOR ELECTROLESS DIRECT BOND PLATING IN HOLES AND ON SURFACES OF A SUBSTRATE Abstract A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and/or on the surfaces of the substrate. The copolymer material contains at least two ionic moieties of a charge opposite from the charge associated with catalyst particles to be subsequently applied prior to the deposition of the conductive metal.

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