Conditioning of polyamides for electroless plating

Details Conditioning of polyamides for electroless plating Conditioning of polyamides for electroless plating

C - Chemistry, Metallurgy

23

F

117/77, 149/9

C23F 17/00 (2006.01) C08G 69/46 (2006.01) C08J 7/12 (2006.01) C23C 18/22 (2006.01) H05K 1/03 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1143260

Abstract of the Invention Polyamide substrates are pre-conditioned for electroless plating by contact with an alkaline aqueous solution having a pH of at least about 10 and etched with an acid solution. The acid solution is preferably an aqueous solution of an organic acid containing at least two carbon atoms, particularly an acetic acid compound, such as trichloracetic acid.

342112

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