Conducting material and a method of fabricating thereof

Details Conducting material and a method of fabricating thereof Conducting material and a method of fabricating thereof

H - Electricity

05

K

31/121, 356/17

H05K 1/02 (2006.01) B32B 18/00 (2006.01) H01B 1/02 (2006.01) H01B 1/08 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H05K 1/09 (2006.01) H05K 3/46 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2004231

ABSTRACT OF THE DISCLOSURE Vias having virtually no pores are formed in a multi- layer ceramic substrate by filling through holes of green sheets with a conducting material consisting of a mixture of copper powder particles and copper oxide powder particles, each coated with an organic titanium compound, and firing the green sheets. The conducting material may be obtained by: kneading mixed copper oxide powder particles and copper powder particles with a solution of an organic titanium compound; drying and cracking the kneaded mixed powder particles; classifying the cracked mixed powder particles; and making the classified mixed powder particles spherical. The multi- layer ceramic substrate may be used as a printed wiring sub- strate for electronic devices.

Affiliated with

Also associated with

Rating

Conducting material and a method of fabricating thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conducting material and a method of fabricating thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conducting material and a method of fabricating thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1813136