Conductive die attach tape

Details Conductive die attach tape Conductive die attach tape

H - Electricity

01

L

356/191

H01L 21/58 (2006.01) H01L 21/68 (2006.01) H01L 23/482 (2006.01) H05K 3/32 (2006.01)

Patent

CA 1222071

CONDUCTIVE DIE ATTACH TAPE Abstract of the Disclosure A conductive die attach tape is described which allows for mounting of diced semiconductor chips there- on, followed by removal of the chip with an adherent conductive adhesive, and the mounting of the chip/ adhesive combination in a chip carrier preparatory to the wire bonding operation.

468276

Affiliated with

Also associated with

Rating

Conductive die attach tape does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive die attach tape, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive die attach tape will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1230891