Conductive epoxy resin formulation and electrical devices in...

Details Conductive epoxy resin formulation and electrical devices in... Conductive epoxy resin formulation and electrical devices in...

H - Electricity

01

B

356/12, 31/154

H01B 1/12 (2006.01) C08G 59/38 (2006.01) C08G 59/40 (2006.01) C09J 163/04 (2006.01) H01B 1/22 (2006.01) H01L 21/60 (2006.01) H01L 23/482 (2006.01) H05K 3/30 (2006.01)

Patent

CA 1142340

Abstract of the Disclosure A technique is described for the preparation of an electrically conductive adhesive system and electrical devices including such system. Briefly, the adhesive system comprises a novolac epoxy resin and a chemically blocked imidazole curing agent in combination with a viscosity reducer and conductive particles. The resulting adhesive system is found comparable to commercially available adhesive systems and is superior thereto with respect to thermal stability.

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