C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
C09D 11/02 (2006.01) B41F 17/00 (2006.01) C03B 19/00 (2006.01) C03C 17/36 (2006.01) H05K 3/12 (2006.01)
Patent
CA 2632592
A conductive ink formulation comprising silver, at least one first solvent, and a cross link wherein the cross link agent is present in an amount of about 1.5 wt% to about 6 wt% based on total weight of the formulation. The conductive ink formulation is suitable for printing on polymer film substrates, in particular with a gravure printing method. The polymer film substrates may be then applied to other substrates, for example glass substrates, by any suitable process such as lamination.
Howells Scott D.
Kriha James A.
Alcan Packaging Flexible France
Bemis Company Inc.
Deeth Williams Wall Llp
LandOfFree
Conductive ink formulations does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductive ink formulations, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive ink formulations will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1472788