Conductive material compositions, apparatus, systems, and...

H - Electricity – 01 – L

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H01L 23/495 (2006.01) H01L 21/02 (2006.01)

Patent

CA 2553438

Various apparatus and systems, as well as methods and articles, may include the use of several compositions, such as solder formulations, including about 78 %-83 % by weight of lead, about 9 %-11 % by weight of antimony, about 1 %-3 % by weight of silver, and a balance of tin. Some embodiments include a process of removing a previously-existing lead finish, and applying a new finish to the lead to improve solder operation compatibility, as well as solder joint reliability in high temperature environments.

Divers dispositifs et systèmes, ainsi que des procédés et des articles, peuvent impliquer l'utilisation de plusieurs compositions, telles que des formulations de soudure, qui contiennent environ 78 à 83 % en poids de plomb, environ 9 à 11 % en poids d'antimoine, environ 1 à 3 % en poids d'argent, le reste étant composé d'étain. Certains modes de réalisation se rapportent à un procédé d'élimination d'un apprêt de plomb précédemment existant, et à appliquer un nouvel apprêt sur le plomb pour améliorer la compatibilité de l'opération de soudage, ainsi que l'efficacité du joint de soudure dans des environnements haute température.

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