Conductive metal-filled composites via developing agents

Details Conductive metal-filled composites via developing agents Conductive metal-filled composites via developing agents

H - Electricity

01

B

18/1211, 31/156,

H01B 1/22 (2006.01) C08J 3/20 (2006.01) C08K 3/08 (2006.01) H05K 9/00 (2006.01)

Patent

CA 1337537

A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.

602048

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