Conductive metallization of substrates via developing agents

Details Conductive metallization of substrates via developing agents Conductive metallization of substrates via developing agents

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B05D 3/02 (2006.01) B32B 15/08 (2006.01) C23C 4/18 (2006.01) C23C 24/08 (2006.01) H01B 1/22 (2006.01) H05K 3/02 (2006.01) H05K 3/10 (2006.01) H05K 3/14 (2006.01) H05K 3/20 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1308311

Abstract of the Disclosure A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.

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