Conductive paste

Details Conductive paste Conductive paste

H - Electricity

01

B

31/184, 117/65

H01B 1/02 (2006.01) B23K 35/26 (2006.01) C22C 28/00 (2006.01) H05K 3/34 (2006.01) H05K 3/40 (2006.01)

Patent

CA 1143933

ABSTRACT OF THE DISCLOSURE A novel conductive paste is disclosed which is suitable for use to connect circuit patterns of a printed circuit board. The conductive paste comprises a melt of gallium and a metal element which forms an eutectic mixture with gallium, and metal powder which alloys with gallium uniformly dispersed in the melt. The content of the metal element and the metal powder are selected to control a solid content in the paste at a predetermined working temperature.

373400

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