Conductive paste

Details Conductive paste Conductive paste

H - Electricity

01

B

H01B 5/16 (2006.01) H01Q 1/38 (2006.01) H05K 1/09 (2006.01) H05K 3/12 (2006.01) G06K 19/077 (2006.01)

Patent

CA 2284978

There is provided a photosetting conductive paste that has a surface resistance of no greater than 200 m.OMEGA./sq. upon curing by light irradiation. The photosetting conductive paste comprises conductive powder and a photosetting resin composition in specific amounts. The conductive powder contains dendritic conductive powder and scaly conductive powder at 80% or greater of the total conductive powder, the dendritic conductive powder having a mean particle size of 0.05-1.0 µm, a specific surface area of 0.5-5.0 m2/g, and the scaly conductive powder having a mean particle size of 1.0-10.0 µm and a specific surface area of 0.5-5.0 m2/g, wherein the weight ratio of the dendritic conductive powder and scaly conductive powder is 6/40 - 95/5. There is also provided a method of forming an antenna for a radio frequency identification medium that comprises printing the conductive paste on a substrate in an antenna-shaped pattern and curing it.

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