Conductive paste composition

Details Conductive paste composition Conductive paste composition

C - Chemistry, Metallurgy

08

L

31/156, 400/7913

C08L 63/00 (2006.01) C08G 59/28 (2006.01) C08G 59/32 (2006.01) C08K 3/08 (2006.01) H01B 1/22 (2006.01) H05K 1/09 (2006.01)

Patent

CA 2039895

ABSTRACT OF THE DISCLOSURE A conductive paste composition is described, which comprises an epoxy resin having a diglycidylamino group, a resol type phenol curing agent, and copper powder. The paste composition exhibits excellent moisture resistance and adhesion and provides a cured film of high conductivity level.

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