Conductor manufactured by the lift-off method

Details Conductor manufactured by the lift-off method Conductor manufactured by the lift-off method

H - Electricity

05

K

356/136

H05K 1/00 (2006.01) H01L 21/00 (2006.01) H01L 23/485 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1042114

ABSTRACT A method of manufacturing a semiconductor device having a conductor pattern in which the semiconductor surface is provided with an insulating layer after which a palladium- containing auxiliary layer is provided on said insulating layer. At the area of the conductor pattern to be provided, the auxl- liary layer is then removed and in the places of the semiconduc- tor surface to be contacted the insulating layer is also removed. After providing a conductive layer, the auxiliary layer with the part of the conductive layer present thereon is then removed in a hydrogen-containing atmosphere. - 13 -

240755

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