Conformatioin of vacuum-laminated solder mask coated printed...

Details Conformatioin of vacuum-laminated solder mask coated printed... Conformatioin of vacuum-laminated solder mask coated printed...

B - Operations, Transporting

32

B

356/1, 154/41

B32B 37/18 (2006.01) G03F 7/16 (2006.01) H05K 3/06 (2006.01) H05K 3/28 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2006206

TITLE IMPROVED CONFORMATION OF VACUUM - LAMINATED SOLDER MASK COATED PRINTED CIRCUIT BOARDS BY FLUID PRESSURIZING ABSTRACT A method is disclosed of obtaining a void free interface between a photosensitive dry film and substrate by applying uniform fluid pressure after vacuum lamination.

Affiliated with

Also associated with

Rating

Conformatioin of vacuum-laminated solder mask coated printed... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conformatioin of vacuum-laminated solder mask coated printed..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conformatioin of vacuum-laminated solder mask coated printed... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1996539