H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/10
H05K 1/14 (2006.01) H01R 4/02 (2006.01) H05K 3/24 (2006.01) H05K 3/34 (2006.01) H05K 3/36 (2006.01) H05K 3/40 (2006.01)
Patent
CA 2010306
ABSTRACT A porous silver plating layer is provided on the sur- faces of pads of a printed circuit board and the contact surfaces provided on the pads of a mother board and these layers are respectively impregnated by tin-zinc alloy and gallium. An electrical connection is established between the pads of the printed circuit board and the pads of the mother board through the formation of a liquid alloy by placing these plating layers in contact with each other. For the one printed circuit board having the pads and spacer, the gallium particles are adhered to the pads, while the solder is tentatively adhered to the spacer and for the other printed circuit board having the pads and connect- ing pads, the tin or indium layer is provided on the surface of pads, then the spacer of the one printed circuit board is position- ed and fixed to the connecting pad of the other printed circuit board. Thereby, electrical connection can be formed through the contact of gallium-tin or gallium-indium liquid alloy between the pads of both printed circuit boards.
Kawano Kyoichiro
Murase Teruo
Tsuji Hiroki
Fetherstonhaugh & Co.
Fujitsu Limited
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