Connecting devices and method for interconnecting circuit...

Details Connecting devices and method for interconnecting circuit... Connecting devices and method for interconnecting circuit...

H - Electricity

01

R

H01R 13/05 (2006.01) H01L 23/498 (2006.01) H01R 33/76 (2006.01) H05K 3/32 (2006.01) H05K 7/10 (2006.01)

Patent

CA 2266158

An integrated circuit package having metallized contact pads is provided with flexible or resilient connecting devices permanently attached onto each contact pad. The connecting devices are flexed when so attached, and are aligned and assembled onto corresponding pads of a printed circuit board, and provide electrical interconnection between the integrated circuit package and a printed circuit board. Electrically conducting connecting devices and method of attaching the devices to the package are described.

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