Connection method and structure to printed circuit board

Details Connection method and structure to printed circuit board Connection method and structure to printed circuit board

H - Electricity

01

R

H01R 12/06 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H05K 1/11 (2006.01) H05K 3/34 (2006.01) H05K 1/00 (2006.01)

Patent

CA 2305977

A connection structure to a printed circuit board which does not require a through-hole or a blind via hole is disclosed. A printed circuit board of a multilayer structure has a plurality of pads embedded together with a wiring pattern in an inner layer thereof. An insulating material on the pads is removed from the printed circuit board to form recesses through which the pads are exposed. A semiconductor package is placed on the printed circuit board, and solder balls of the semiconductor package are directly connected to the pads through the recesses.

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