Connection structure of wire and terminal, connecting method...

Details Connection structure of wire and terminal, connecting method... Connection structure of wire and terminal, connecting method...

H - Electricity

01

R

H01R 9/24 (2006.01) B23K 1/06 (2006.01) H01R 4/02 (2006.01) H01R 13/405 (2006.01) H01R 13/504 (2006.01) H01R 43/02 (2006.01)

Patent

CA 2238921

A soldering material (28) is joined to a surface (13a) of a terminal (13). The terminal (13) is incorporated in a groove (18) of a connector housing (11) so that a covered wire (19) is made into contact with the terminal (13). A cover (12) is mounted so as to insert protrusions (22) into the grooves (18). By carrying out ultrasonic vibration while applying a pressure by a ultrasonic horn, a covering portion of the covered wire is melted and removed. The soldering material (28) is melted by heat generated when the covering portion is melted so that the soldering material (28) is made into contact with the cores thereby the cores and terminal (13) being connected with each other through the soldering material (28). As a result, the soldering material (28) makes a firm contact with the cores.

Un métal d'apport (28) est appliqué sur une surface (13a) d'une borne (13). La borne (13) est placée dans une gorge (18) d'un boîtier de connecteur (11) de manière qu'un conducteur gainé (19) soit en contact avec elle. Un couvercle (12) est mis en place de manière que ses bossages (22) s'insèrent dans les gorges (18). En soumettant le conducteur gainé à une vibration ultrasonore et à une pression au moyen d'un générateur d'ultrasons, on fait fondre une partie de la gaine d'enrobage pour dénuder le conducteur. Le métal d'apport (28) fond en même temps que la gaine d'enrobage de manière à couler entre le conducteur et la borne (13) et à réaliser ainsi la connexion de l'un à l'autre. Après solidification, le métal d'apport (28) constitue un lien ferme entre conducteurs et bornes.

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