B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
327/84
B23K 3/00 (2006.01) B23K 35/02 (2006.01) H01L 23/498 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2002927
MP1282 ABSTRACT A connection to a contact on an electronic component is made by means of a solder preform in the form of a column, which comprises a solder body at least partially enclosed within a tubular support. The preform is positioned such that its longitudinal axis is approximately parallel to the plane of the contacts at the point at which it is connected thereto.
Geschwind Gary I.
Leary Rebecca A.
Svendsen Leo G.
Geschwind Gary I.
Leary Rebecca A.
Marks & Clerk
Svendsen Leo G.
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