C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 77/10 (2006.01) C08L 51/06 (2006.01) C08L 77/00 (2006.01) C08L 77/06 (2006.01) H01R 13/46 (2006.01)
Patent
CA 2086052
A connector comprising a housing comprising a resin composition comprising: (A) from 50 to 95 parts by weight of a semi-aromatic polyamide comprising (A1) an adipate of hexamethylenediamine and (A2) a terephthalate of hexamethylenediamine, where the weight ratio of the adipate of hexamethylenediamine (A1) to the terephthalate of hexamethylenediamine (A2) is from 80/20 to 50/50; and (B) from 5 to 50 parts by weight of a modified polyolefin comprising (B1) a polyolefin copolymer comprising (B11) propylene and (B12) ethylene where the molar ratio of propylene (B11) to ethylene (B12) is from 90/10 to 99/1, the polyolefin copolymer (B1) being graft-modified with (B2) from 0.05 to 5 parts by weight of an .alpha.,.beta.-unsaturated carboxylic acid, an anhydride thereof, or a derivative thereof per 100 parts by weight of the polyolefin copolymer (B1).
Kanda Masahiro
Kato Tetsuo
Nakamoto Satoru
Tsumiyama Tatsuo
Riches Mckenzie & Herbert Llp
Ube Industries Ltd.
Yazaki Corporation
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