Connector assembly for electrically interconnecting two...

H - Electricity – 01 – R

Patent

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H01R 12/16 (2006.01)

Patent

CA 2188149

A connector assembly for electrically interconnecting first (62) and second printed circuit board (52) like members having electrical contacts (60 and 70) thereon includes an elongated biasing member (42) for being mounted on the first printedcircuit board like member and flexible circuitry (56) mounted on the biasing member. The biasing member possesses arm portions (50) which are spaced apart to define therebetween a longitudinal opening for receiving a second printed circuit board like member. An elastomer sheet (72) is positioned between the contact pads of the flexible circuitry and the arm portions of the biasing member for allowing individual contact pads to move relative to other contact pads so as to compensate for height variations of the various electrical conductors on the second printed circuit board like member end thickness variations in the second printed circuit board like member.

Un ensemble connecteur pour l'interconnexion électrique de deux éléments tels qu'une première plaque (62) de circuits imprimés et une seconde plaque (52) de circuits imprimés, sur lesquels se trouvent des contacts électriques (60 et 70), comprend un élément de sollicitation allongé (42) qui se monte sur la première plaque de circuits imprimés et un circuit flexible (56) monté sur l'élément de sollicitation. L'élément de sollicitation possède des parties bras (50) qui sont espacées afin de définir entre elles une ouverture longitudinale dans laquelle est reçue la seconde plaque de circuits imprimés. Une feuille en élastomère (72) est positionnée entre les lots de contact du circuit flexible et les parties bras de l'élément de sollicitation afin de permettre aux plots de contact de se déplacer par rapport à d'autres plots de contact et compenser ainsi les variations de hauteur des différents conducteurs électriques sur la seconde plaque de circuits imprimés et également les variations d'épaisseur dans la seconde plaque de circuits imprimés.

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