Connector system for connection of leadless large scale...

Details Connector system for connection of leadless large scale... Connector system for connection of leadless large scale...

H - Electricity

05

K

339/11.2

H05K 7/10 (2006.01) H01L 23/40 (2006.01)

Patent

CA 1116708

File No. 914,973 ABSTRACT A system for connecting LSI devices to a printed circuit board comprising a leadless ceramic carrier, a leaded socket and a cover member wherein contact is made between the LSI device and the printed circuit board through contacts contained in the socket. The leadless ceramic carrier serves as a protective package for the LSI device to the carrier. The leaded socket connects the paths on the leadless carrier to the circuit board via contact elements enclosed with- in the leaded socket. The cover member holds the leadless carrier in place and dissipates the heat which is generated by the LSI in the carrier.

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