C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
400/4112, 154/10
C09J 175/04 (2006.01) C09J 5/00 (2006.01) C09J 163/00 (2006.01) C09J 183/04 (2006.01)
Patent
CA 2036074
The adhesive to be used for the proposed method does not include any solvent and is safe for hygiene and effective for fire prevention. The adhesive is of a contact type, which permits adherends to be easily fastened without being temporarily pressed, and is applicable to any type of adherends contrary to aqueous adhesives, and is cured under room temperature in a relatively short period of time even if the adherends are not of a moisture-permeating type.
Aoki Hiroshi
Horie Toshiharu
Makino Zyunzo
Nishikawa Nobuyoshi
Okuno Eiichi
Cemedine Co. Ltd.
Smart & Biggar
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