Contact bonding and packaging of integrated circuits

Details Contact bonding and packaging of integrated circuits Contact bonding and packaging of integrated circuits

H - Electricity

01

L

356/146

H01L 23/495 (2006.01) H01L 21/00 (2006.01) H01L 21/60 (2006.01) H01L 23/057 (2006.01) H01L 23/31 (2006.01)

Patent

CA 922021

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