Contact element

Details Contact element Contact element

C - Chemistry, Metallurgy

25

D

C25D 17/00 (2006.01) C25D 7/00 (2006.01) C25D 17/06 (2006.01) C25D 17/08 (2006.01) C25D 17/12 (2006.01) H05K 3/18 (2006.01) H05K 3/24 (2006.01)

Patent

CA 2341218

It is difficult to transmit large processing current on the surfaces of printed circuit boards (L) using clamp-type contact organs ( 6, 7). In order to solve said problem, contact elements (15, 16) having one or more contact surfaces (26) are disposed on the contact organs (6, 7). The shape of the contact surfaces (26) are configured in such a way that no damages occur in the areas of the conductive surfaces adjacent to the contact surfaces (26) when large currents are transmitted from the contact elements (15, 16) printed on the electrically conductive surface of printed board material (L) on the contact surfaces to the conductive surface.

Avec des organes d'établissement de contact (6, 7) du type pince, le transfert d'un important courant de traitement à la surface de plaquettes de circuits imprimés (L) est difficile. Pour que ce problème soit résolu, il est proposé, selon l'invention, d'utiliser des éléments de contact (15, 16) disposés sur les organes de mise en contact (6, 7), ces éléments de contact présentant une ou plusieurs surfaces de contact (26). La forme des surfaces de contact (26) est telle que lors du transfert de courant important de l'élément de contact (15, 16) appliqué sur des surfaces de contact d'une surface électroconductrice d'un matériau de plaque de circuit imprimé (L), aucun dommage ne se produit sur la surface conductrice, dans les zones de cette surface adjacente aux surfaces de contact (26).

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