Contact material for compression bonded semiconductor devices

Details Contact material for compression bonded semiconductor devices Contact material for compression bonded semiconductor devices

H - Electricity

01

L

356/184

H01L 23/48 (2006.01) H01L 23/492 (2006.01)

Patent

CA 1218765

9 50,981 ABSTRACT OF THE DISCLOSURE The present invention teaches the use of a nickel clad silver foil member between an aluminum ohmic contact and a nickel clad copper pole piece in a compres- sion bonded power semiconductor device. The nickel-to- aluminum interface provides stable device operation by preventing the "battery effect" which occurs when aluminum and silver are interfaced.

471666

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