Contactless test method and system for testing printed...

Details Contactless test method and system for testing printed... Contactless test method and system for testing printed...

G - Physics

01

R

G01R 31/308 (2006.01) G01R 31/315 (2006.01)

Patent

CA 2162099

A method and apparatus are disclosed for testing unpopulated and inactive populated printed circuit boards for manufacturing defects. The method and apparatus do not require electrical contact with the board under test. The method and apparatus include an AC source, which is connected to the stimulator(s). The stimulator(s) radiate an electromagnetic field onto the traces and components on the board under test and this interaction establishes a potential gradient along the traces and components as the BUT is scanned. A sensor array is located adjacent to a stimulator (if only one is used) or between a pair of stimulators (if a dual arrangement is used) and detects the displacement currents flowing from the board under test. The sensors and stimulator(s) do not electrically connect to the board under test, which is positioned between a ground reference plane and a sensor/stimulator unit. By scanning across the entire surface of the board under test, a displacement current signature of the board under test is obtained. Manufacturing defects on the board under test are found by computer analysis of the displacement current signature.

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