Continuous electroplating of conductive foams

C - Chemistry – Metallurgy – 25 – D

Patent

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319/101, 204/127

C25D 7/06 (2006.01) C25D 5/54 (2006.01) C25D 17/00 (2006.01) C25D 17/10 (2006.01) H01M 4/80 (2006.01)

Patent

CA 2020638

The present invention resides in the discovery that a strip of reticulated foam which is semi-conductive can be continuously electroplated, utilizing a cathode roll which is positioned, in a first electroplating zone, outside of the electroplating bath. An anode is immersed in the electroplating bath. The strip of reticulated foam is first introduced into the electroplating bath and travels in the direction from the anode to the cathode roll prior to contacting the cathode roll. In this way, the strip achieves a partial plate at the anode which provides a current path between the anode and the cathode roll effective for sustaining the plating reaction in said first electroplating zone.

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