C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
319/101, 204/127
C25D 7/06 (2006.01) C25D 5/54 (2006.01) C25D 17/00 (2006.01) C25D 17/10 (2006.01) H01M 4/80 (2006.01)
Patent
CA 2020638
The present invention resides in the discovery that a strip of reticulated foam which is semi-conductive can be continuously electroplated, utilizing a cathode roll which is positioned, in a first electroplating zone, outside of the electroplating bath. An anode is immersed in the electroplating bath. The strip of reticulated foam is first introduced into the electroplating bath and travels in the direction from the anode to the cathode roll prior to contacting the cathode roll. In this way, the strip achieves a partial plate at the anode which provides a current path between the anode and the cathode roll effective for sustaining the plating reaction in said first electroplating zone.
Bean Andrew S.
Brannan James R.
Stewart James J.
Vaccaro Anthony J.
Eltech Systems Corporation
Gowling Lafleur Henderson Llp
LandOfFree
Continuous electroplating of conductive foams does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Continuous electroplating of conductive foams, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Continuous electroplating of conductive foams will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1447584