Continuous filament mat binder system

C - Chemistry – Metallurgy – 08 – J

Patent

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Details

C08J 7/04 (2006.01) B29C 70/52 (2006.01) C03C 25/28 (2006.01) C03C 25/40 (2006.01) C04B 24/26 (2006.01) C08K 5/54 (2006.01) C08K 5/5435 (2006.01) C08K 5/544 (2006.01) C08K 9/08 (2006.01) C09D 7/12 (2006.01) C09J 131/04 (2006.01) C09K 3/10 (2006.01)

Patent

CA 2483685

A binder slurry (24) for a continuous filament mat (50) used in a phenolic pultrusion system comprising a phenolic compatible silane, a non-ionic surfactant, a defoamer, water, an organic acid and a polyvinyl acetate copolymer binder. The binder slurry resin is unique in that the polyvinyl acetate copolymer binder is compatible with presently available phenolic resins, and as such pultruded parts made have improved surface and mechanical properties as compared with traditional polyester type binder slurries which are not compatible with phenolic resins.

L'invention concerne une suspension de liant (24) destinée à un treillis de filaments continu (50) employé dans un système d'extrusion par étirage phénolique. Ladite suspension contient un silane phénolique compatible, un agent tensioactif non ionique, un agent antimousse, de l'eau, un acide organique et un liant copolymère d'acétate de vinyle. La résine de la suspension de liant est caractérisée en ce que le liant copolymère d'acétate de vinyle est compatible avec des résines phénoliques d'usage courant, et lorsqu'elle entre dans la constitution d'éléments extrudés par étirage, ladite résine présente des propriétés mécaniques et de surface améliorées par rapport à des suspensions de liant de type polyester habituelles qui ne sont pas compatibles avec des résines phénoliques.

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