Continuous solder processing system

Details Continuous solder processing system Continuous solder processing system

B - Operations, Transporting

23

K

113/89

B23K 3/04 (2006.01) B23K 1/015 (2006.01) B23K 3/06 (2006.01)

Patent

CA 1241237

ABSTRACT A system and method for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. After solder application, the product is subjected to a solder leveling or Deb ridging operation by passage past one or more nozzles which direct streams of vapor phase condensate onto the product surfaces. Each of the operations is separately controllable and is substantially independent of the control of the other operations of the overall system.

481480

Affiliated with

Also associated with

Rating

Continuous solder processing system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Continuous solder processing system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Continuous solder processing system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1292252