C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
400/2026, 400/30
C09J 157/00 (2006.01) C08F 293/00 (2006.01) C08L 53/00 (2006.01) C09J 4/06 (2006.01) H01L 21/58 (2006.01) H05K 3/30 (2006.01) H05K 3/36 (2006.01)
Patent
CA 2038117
Docket Number 44591CAN2A ABSTRACT The present invention provides controllably curable photoiniferter containing adhesive compositions which are suitable for the mounting of microelectronic devices such as flip chips onto transparent wiring boards, a method of making the adhesive compositions, and a method of using the adhesive compositions in order to bond microelectronic devices to transparent wiring boards by intermittent exposure of the adhesive composition to a radiant energy source. The adhesive compositions can be cured in a stepwise fashion by intermittent controlled exposure to a source of radiation thus providing exactly the amount of cure and hardening desired.
Ali Mahfuza B.
Pujol Jean-Marc
Minnesota Mining And Manufacturing Company
Smart & Biggar
LandOfFree
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