Controllably monitoring and reducing a material

Details Controllably monitoring and reducing a material Controllably monitoring and reducing a material

B - Operations, Transporting

24

B

B24B 49/10 (2006.01) B23H 9/06 (2006.01) B24B 37/04 (2006.01)

Patent

CA 2328274

The instant invention provides a vibration insensitive method of precisely polishing an object. The method includes the steps of providing an object to be polished, applying a conductive material to a non-electrical current conductive surface of the object (alternatively, if the object conducts electric current, the object should be coated with a thin layer of non-electric current conductive material using methods known to those skilled in the art), removing a portion of the object and the conductive material through polishing, and measuring an electric current flowing through the conductive material to monitor a progress of the polishing. Advantageously, the method does not require the polishing process to be interrupted to monitor the progress of the polishing. In fact, since the progress is measured as a function of resistance/electrical current, the progress is measured with an accuracy and precision related to each individual turn of a polishing pad. Advantageously, the instant method is remarkably vibration insensitive and is practical for the simultaneous, automatic, and precise, polishing of monolithic objects.

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