C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 17/18 (2006.01) C25D 17/10 (2006.01) C25D 17/28 (2006.01) C25D 21/12 (2006.01) H05K 3/00 (2006.01) H05K 3/24 (2006.01)
Patent
CA 2469880
To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plating printed circuit boards are proposed which provide measures for reducing an electric voltage that builds up between adjacent printed circuit boards being conveyed through the line.
Selon cette invention, afin d'éviter des vides dans la couche métallique dans des trous de cartes de circuits imprimés, une chaîne d'électrodéposition à transporteur et un procédé de revêtement métallique électrolytique de cartes de circuits imprimés permettent de réduire une tension électrique qui apparaît entre des cartes de circuits imprimés adjacentes transportées à travers la chaîne.
Hubel Egon
Atotech Deutschland Gmbh
Riches Mckenzie & Herbert Llp
LandOfFree
Conveyorized plating line and method for electrolytically... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conveyorized plating line and method for electrolytically..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conveyorized plating line and method for electrolytically... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1739653