Cooling assembly

Details Cooling assembly Cooling assembly

H - Electricity

01

L

H01L 23/40 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2625635

In a method for cooling an electronic application (1; 101) having at least one heat-generating electronic component (3) mounted on a circuit board (2), a heat sink (6) is attached to the circuit board in heat transferring thermal contact (6T, 3T) with one heat generating electronic component (3) by first being statically fixed to the circuit board in a stationary position at a specified height (L) above said circuit board and by then being resiliently biasing the component against the heat sink.

Dans un procédé de refroidissement d~une application électronique (1 ; 101) ayant au moins un composant électronique thermogène (3) monté sur une carte de circuit imprimé (2), un dissipateur thermique (6) est fixé à la carte de circuit imprimé en contact de transfert thermique (6T, 3T) avec un composant électronique thermogène (3), tout d~abord par fixation statique à la carte de circuit imprimé dans une position stationnaire à une hauteur (L) spécifique au-dessus de ladite carte de circuit imprimé, puis par déviation élastique du composant contre le dissipateur thermique.

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