Cooling body for semi-conductor components, process for its...

Details Cooling body for semi-conductor components, process for its... Cooling body for semi-conductor components, process for its...

H - Electricity

01

L

H01L 23/36 (2006.01) H01L 21/48 (2006.01) H01L 23/367 (2006.01)

Patent

CA 2355591

In a cooling body (10) of metal material, in particular a light metal alloy, for semi-conductor elements or similar components, plate-like cooling ribs (20, 20e) projecting from a base plate (12) at intervals (f) and approximately parallel to each other, protrude with a connection strip (24) into the base plate in which they are cast. A moulding tool designed for production of this cooling body (10) is formed as a casting mould (30) with a mould chamber for the base plate (12) and this mould chamber contains an area to receive the connection strips (24) of the cooling ribs (20, 20e). Two parallel side walls (34) of the casting mould (30) and intermediate layers (28) arranged parallel between them, each bordering a receiver gap (29), are arranged displaceably on at least one shaft (19) passing through them and can be moved on this to produce the compact casting mould (30) after insertion of the cooling ribs (20, 20e) in the receiver gaps (29).

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