H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/113
H01L 23/46 (2006.01) H01L 23/473 (2006.01)
Patent
CA 1223087
Abstract Cooling body for the liquid cooling of high- power semiconductor components In a disc-shaped cooling body (1) which has, in the semiconductor supporting surface illustrated, cooling slits (3) which are connected via two connecting channels (4) to a collecting channel (7) for the supply of a cooling liquid, for example oil, cooling elements (9) are provided at the edge to improve the cooling effect. These cooling elements can be designed as cooling ribs, cooling fingers or cooling needles. The cooling liquid flows out of the cooling slits (3) at an angle (?) of preferably 60° to 70°, so that it flows over a relatively long distance along the outer edge of the cooling body (1) and between the cooling elements (9) of the latter and thereby dissipates heat from the cool- ing body and from the cooling elements. The cooling slits can extend radially, widening outwards, or in serpentine or involute form or spirally and can have a rectangular or triangular or semi-circular or trapezoidal cross-section. (Figure 4)
465580
Daimlerchrysler Rail Systems Gmbh
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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