Cooling container for liquid-cooled semiconductor...

H - Electricity – 05 – K

Patent

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321/18, 26/182,

H05K 7/20 (2006.01) H01L 23/40 (2006.01)

Patent

CA 1077564

TITLE OF THE INVENTION: COOLING CONTAINER FOR LIQUID-COOLED SEMICONDUCTOR CONSTRUCTION ELEMENTS AND MANUFACTURING PROCESS FOR SUCH A COOLING CONTAINER ABSTRACT OF THE DISCLOSURE A cooling container for liquid-cooled semiconductor construction elements wherein pegs are located in the interior of the container in the flow path of the cooling liquid and arranged vertically to the floors of the container and connected with these floors so that they are tight in regard to their material. Preferably, these pegs have a square cross-section and with one diagonal are located transversely to the flow direction. In addition, barriers are located at half the distance of flow in the cooling container, which are diametrically opposite for the purpose of narrowing the cross-section of the flow.

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