Cooling device for electronic components

G - Physics – 06 – F

Patent

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Details

G06F 1/20 (2006.01) H01L 23/427 (2006.01)

Patent

CA 2374008

The invention relates to a cooling device for electronic components, especially for cooling microprocessors. The inventive device has at least one passive heat-conducting cooling element (12). At least one part of the passive cooling element (12) is connected to at least one heat transmission medium (20) which is in a solid state of aggregation and is a phase change material (PCM) having a heat receiving capacity that is many times higher compared to water and is configured as a PCM device. The heat transmission medium (20) stores the heat quantity which is produced by charging the electronic component and cannot be received and discharged by the passive cooling element (18) any longer, whereby the solid state of aggregation is maintained. Said medium releases said heat when the electronic component is charged less.

La présente invention concerne un dispositif de refroidissement destiné à des composants électroniques, en particulier au refroidissement de microprocesseurs, comportant au moins un élément de refroidissement thermoconducteur passif (12), au moins une partie de l'élément de refroidissement passif (12) se trouvant en contact avec un milieu de transfert thermique (20) à l'état solide. Ce milieu de transfert thermique (20) est un matériau de transition de phase (PCM Phase Change Material) présentant une capacité d'absorption de chaleur nettement supérieure à celle de l'eau, et est conçu en tant qu'accumulateur de chaleur latente. Le milieu de transfert thermique (20) accumule la quantité de chaleur produite par la charge du composant électronique ne pouvant plus être absorbée ni évacuée par l'élément de refroidissement passif (18), avec conservation de l'état solide, puis évacue à nouveau cette quantité de chaleur lorsque la charge sur le composant électronique diminue.

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